Negotiable
The date of payment from buyers deliver within days
Guangdong
Long-term effective
2017-10-16 19:21
143
Company Profile
Shenzhen Rigao Electronics Co., Ltd.By certification [File Integrity]
Contact:Mr. Alex Su(Mr.)
Email:
Telephone:
Phone:
Area:Guangdong
Address:Guangdong
No | Item | Speccification |
1 | PCB Layers | Mass production:2~58layers / Poilt run :64Layers |
2 | Board thickness | 0.2mm~0.3mm |
3 | Copper Thickness | 0.5OZ~4OZ |
4 | Surface Finishing | HASL,Immersion Gold,Immersion Tin,OSP,OPS+ENIG,Immersion Silver,ENEPIG,Gold Finger |
5 | Gerber files | Gerber file or other pcb file is acceptable |
6 | Min.Hole size | Mechanical drill:0.2mm Laser drill : 0.075mm |
7 | Min.Line Width | 0.1mm |
8 | Min.Line Spacing | 0.1mm |
9 | Min.Solder Mask Clearance | 0.076mm |
10 | Min.Annular Ring | 0.076mm |
11 | Max.Panel Size | 1150mm*560mm |
12 | Max.Copper Thickness | UL certificated:6.0 OZ / Polit run :12 OZ |
13 | Profile and V-Cut | V-Cut, Jump V-Cut, CNC V-Cut, CNC-Routing, Stamping and Believeing |
Content | General | Advanced | ||||
1 | TH components: | Wave-soldering | NA | |||
2 | Min. Chip Placement: | 0402 | 0201 | |||
3 | QFN Lead Pitch: | 0.4mm | 0.3mm | |||
4 | Min. IC Pitch: | 0.4mm | 0.3mm | |||
5 | Maximum BGA Size: | 50mm X 50mm | 74mm X 74mm | |||
BGA Ball Pitch: | 0.4mm | 0.3mm | ||||
6 | Max. PCB Size: | 350mm X 400mm | 410mm X 600mm | |||
Foot Pin: | SO, SOP, SOJ, TSOP, TSSOP, QFP, BGA and U-BGA |
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